18-625 ULSI Mobile Platform and Server Product Design
12 units, Carnegie Mellon University
The objective of this class is to design an ULSI Ultra Large Scale Integrated mobile platform and a server product in two scenarios System on Chip SoC and System in Package SiP. Stateoftheart 2016 technology nodes 28nm, 20nm or 14nm will be assumed for the SoC scenario and full 3D integration with Through Silicon Vias TSV will be pursued for the 2020 SiP scenario. Students will be given all the necessary technology data device performance, interconnect parasitics, wafer and TSVpackaging costs, and also the expected yield data. The design objective is to deliver a product competitive to the leading products available on the market or anticipated in 5 years. The complete product design will be carried out focusing on the processor cores, graphics and the embedded memories including new generation memories in the 2020 scenarios. System performance and power will be estimated using provided simulators for specified benchmarks. The goal is to minimize the product cost by maximizing the number of good die per wafer while achieving competitive product performance and power objectives. Prerequisites 18664 or instructor permission
Prerequisites: 18-664
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